3D Stacked Chips: From Emerging Processes to Heterogeneous Systems
Product details
| Management number | 233377886 | Release Date | 2026/06/27 | List Price | US$19.18 | Model Number | 233377886 | ||
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This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single package of the smallest possible size. The authors focus on heterogeneous 3D integration, addressing some of the most important challenges in this emerging technology, including contactless, optics-based, and carbon-nanotube-based 3D integration, as well as signal-integrity and thermal management issues in copper-based 3D integration. Coverage also includes the 3D heterogeneous integration of power sources, photonic devices, and non-volatile memories based on new materials systems. Read more
| ISBN10 | 3319793055 |
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| ISBN13 | 978-3319793054 |
| Edition | Softcover reprint of the original 1st ed. 2016 |
| Language | English |
| Publisher | Springer |
| Dimensions | 6.1 x 0.82 x 9.25 inches |
| Item Weight | 1.12 pounds |
| Print length | 362 pages |
| Publication date | May 26, 2018 |
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